COM-HPC – I-Pi SMARC

COM-HPC

COM-HPC is the cutting-edge open standard for embedded computing modules designed to meet the demands of high-end IoT and edge server applications. With a variety of sizes and configurations, COM-HPC modules deliver server-class bandwidth, power, and performance. Since its ratification in 2021, COM-HPC solutions have been successfully deployed across numerous industries, showcasing their versatility and reliability.

COM-HPC Server Type Modules

COM-HPC offers two server module types, including the largest, Size E (200mm x 160mm), which features up to eight on-board DIMM sockets. The modules have a single 12-volt power supply capable of delivering up to 358 watts and support 64x lanes of PCIe Gen5. Additionally, COM-HPC server modules support the Intelligent Platform Management Bus (IPMB) and the Intelligent Platform Management Interface (IPMI), providing management and monitoring capabilities independently of the host system's CPU, firmware, and operating system. These modules are ideal for a range of applications, such as general-purpose rugged embedded computers, mission-critical servers, stationary and mobile robotics, medical imaging and robotic surgery, test and measurement, and autonomous driving.

COM-HPC Server Type Module

COM-HPC-sIDH

COM-HPC-sIDH

COM-HPC Server Type Size D Module with IntelĀ® XeonĀ® D-2700 Processor (formerly codename: Ice Lake-D)

COM-HPC-ALT

COM-HPC-ALT

COM-HPC Server Type Size E Module with AmpereĀ® AltraĀ® SoC

Arm Development Platform

Ampere Altra Developer Platform

Ampere Altra Developer Platform

COM-HPC Server Type Size E Reference Development Platform based on AmpereĀ® AltraĀ® SoC

Ampere Altra Developer Rugged

Ampere Altra Developer Rugged

Rugged COM-HPC Server Type Size E Reference Development Platform based on AmpereĀ® AltraĀ® SoC

Starter Kits

COM-HPC Server Type Ice Lake-D Starter Kit

COM-HPC Server Type Ice Lake-D Starter Kit

Starter Kit for COM-HPC-sIDH

Ampere Altra Dev Kit

Ampere Altra Dev Kit

COM-HPC Server Type Development Kit based on AmpereĀ® AltraĀ® SoC

COM-HPC Client Type Modules

The COM-HPC specification defines three client modules: Size A (95mm x 120mm), Size B (120mm x 120mm), and Size C (160mm x 120mm). The largest client module, Size C, offers up to four on-board SO-DIMM sockets and a single 12-volt power supply that can deliver up to 251 watts. It also features 49x lanes of PCIe Gen5 in total. These client modules are designed for high-end embedded client products, needing one or more displays, a full set of low, medium, and very high bandwidth I/O for fast data transfer, powerful CPUs, and modest size.

While the standard primarily focuses on x86 implementations, it supports traditional x86 systems and power-efficent CPU architectures like ARM64, enhancing performance and energy efficiency for specialized modules. The applications for COM-HPC client modules are diverse, including medical equipment, test & measurement, rugged embedded computers, transportation systems, and more.

Explore the powerful capabilities of COM-HPC modules and find the perfect solution for your high-performance embedded computing needs.

COM-HPC Client Type Module

COM-HPC-cRLS

COM-HPC-cRLS

Client Type COM-HPC Size C Module with 13th Gen IntelĀ® Coreā„¢ Desktop Processor