COM Express Type 6 Alder Lake-P – I-Pi SMARC

COM Express Type 6 Alder Lake-P

COM Express Type 6 Alder Lake-P product image.

PRODUCT INFORMATION

IoT Prototype Kit based on Intel Alder Lake-P

BOX INCLUDING:

  • Express-ADP Com Express Type 6 Basic size with Intel® 12th Gen Core™ i5-12600HE / i3-12300HE (Alder Lake-P)
  • Express Base 6 R3.1 carrier
  • THSF-ADP-B heatsink with active fan
  • Debug board (DB30 x86), with cables
  • Cable kit (SATA cable and Pin-header to DB9 adapter cable for COM port)

SPECIFICATIONS:

Intel 12th Gen. hybrid-architecture Core™ i5-12600HE / i3-12300HE with 4x Performance cores and 8/4x Efficient cores, integrated with powerful Intel® Iris Xe graphics, supporting three display output through 2x USB4, and 1x DP, 1x PCIe Gen4 x8, 1x 2.5GbE LAN, multiple PCIe Gen3 lanes, 4x USB 3.x/2.0/1.1, 2x USB 2.0/1.1, 2x SATA, 4x COM Port, and 8x GPIO and header for SMBUs/I2C

COM Express Type 6 Alder Lake-P product components and details.

HOW IT WORKS

COM Express Type 6 Alder Lake-P consists of a simple carrier paired with a COM.0 R3.1 Computer-on-Module.

The module features Intel 12th Gen Core™ i5-12600HE/i3-12300HE with 4x Performance cores and 8/4x Efficient cores, Intel Iris Xe  graphics, offering unmatched performance and power per watt and high flexibility.

Modules are specifically designed for typical industrial
embedded applications that require long life, high MTBF, and strict revision control.